Honor Pad X9 对比 Honor MagicPad 13

Price: RM679   1099 RM2309  
发布
Release Status Release 2023, Jul 20 Coming soon. Exp. release 2023, July
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (1x2.84 GHz Cortex-X1 & 3x2.42 GHz Cortex-A78 & 4x1.80 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM8350 Snapdragon 888 5G (5 nm)
GPU Adreno 610 Adreno 660
Memory 128GB, 4GB RAM 256GB 8GB RAM, 256GB 12GB RAM, 512GB 16GB RAM
Card Slot No No
Battery Li-Po 7250 mAh, non-removable battery Li-Po 10050 mAh, non-removable battery
66W wired
5W reverse wired
OS Android 13, MagicOS 7.1 Android 13, MagicOS 7.2
显示屏
Display Type TFT LCD, 120Hz TFT LCD, 1B colors, 144Hz, IMAX Enhanced, HDR10, 700 nits (HBM)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
13.0 inches, 494.7 cm2 (~88.7% screen-to-body ratio)
1840 x 2880 pixels (~263 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 291.7 x 191.1 x 6.5 mm
Body Weight 495g 673g
Body Type Glass front, aluminum frame, aluminum back Stylus support (2ms)
Colors Space Gray Gray, Blue, Gold
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.0, AF
Front Camera 5 MP, f/2.2 9 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR LED flash, HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac/6, dual-band
Bluetooth 5.1, A2DP, LE 5.2, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 3.2, OTG, DisplayPort, magnetic connector
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack No No

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