Honor Pad X9 对比 realme Pad

Price: RM679   1099 RM599   999
发布
Release Status Release 2023, Jul 20 Release 2021, Nov 03
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Mediatek MT6769V/CU Helio G80 (12 nm)
GPU Adreno 610 Mali-G52 MC2
Memory 128GB, 4GB RAM 4GB + 64GB
Card Slot No microSDXC (uses shared SIM slot)
Battery Li-Po 7250 mAh, non-removable battery Li-Po 7100 mAh, non-removable battery
Fast charging 18W
Reverse charging
OS Android 13, MagicOS 7.1 Android 11
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 360 nits (typ)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
10.4 inches, 307.9 cm2 (~80.2% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~224 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 246.1 x 155.9 x 6.9 mm
Body Weight 495g 440g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Colors Space Gray Gray, Gold
摄像头
Rear Camera 5 MP, f/2.2, AF 8 MP
Front Camera 5 MP, f/2.2 8 MP, 105˚ (ultrawide)
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer Accelerometer, gyro, proximity
GPS Yes, with A-GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
-22.4 LUFS (Excellent)
3.5mm Jack No Yes
24-bit/192kHz audio

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