Honor Pad X9 对比 Xiaomi Pad 5

Price: RM679   1099 RM889   1399
发布
Release Status Release 2023, Jul 20 Release 2021, Sep 23
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (1x2.96 GHz Kryo 485 Gold & 3x2.42 GHz Kryo 485 Gold & 4x1.78 GHz Kryo 485 Silver)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm Snapdragon 860 (7 nm)
GPU Adreno 610 Adreno 640
Memory 128GB, 4GB RAM 128GB 6GB RAM, UFS 3.1
Card Slot No No
Battery Li-Po 7250 mAh, non-removable battery Li-Po 8720 mAh, non-removable battery
Fast charging 33W
Power Delivery 3.0
OS Android 13, MagicOS 7.1 Android 11, MIUI 12.5
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 1B colors, 120Hz, HDR10, Dolby Vision
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
11.0 inches, 350.9 cm2 (~82.8% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~274 ppi density)
Display Features Wide color gamut
True-tone
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 254.7 x 166.3 x 6.9 mm
Body Weight 495g 511g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum back, plastic back
Stylus support (magnetic)
Colors Space Gray Cosmic Gray and Pearl White
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.0
Front Camera 5 MP, f/2.2 8 MP, f/2.0
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR Dual-LED flash, HDR, panorama
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C
传感器
Sensor Accelerometer Accelerometer, gyro, proximity, compass
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
-24.4 LUFS (Very good)
3.5mm Jack No No
24-bit/192kHz audio

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