realme Pad X 对比 Honor Pad 9

Price: RM709   1699 RM1479   1799
发布
Release Status Release 2022, May 26 Release 2024, Apr 22
性能与续航
CPU Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6375 Snapdragon 695 5G (6 nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 619 Adreno 710
Memory 6GB RAM, 128GB ROM 256GB, 16GB RAM
Card Slot microSDXC microSDXC (cellular model only)
Battery Li-Po 8340 mAh, non-removable battery
Fast charging 33W
Reverse charging
USB Power Delivery
Li-Po 8300 mAh, non-removable battery
35W wired
OS Android, Realme UI 3.0 Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 450 nits (peak) IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 6.9 mm
Body Weight 499g 568g
Body Type Glass front, plastic frame, plastic back
Stylus support (magnetic charging)
Glass front, aluminum frame, aluminum back
Stylus support
Colors Glowing Gray, Glacier Blue Space Gray, Cyan Lake
摄像头
Rear Camera 13 MP, f/2.2, (wide) 13 MP, f/2.0, (wide), AF
Front Camera 8 MP, f/2.0, 105˚ (ultrawide) 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features Panorama HDR
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by) Yes
Data Speed HSPA 42.2/5.76 Mbps, LTE LTE, 5G
WLAN Wi-Fi 802.11 b/g/n/ac, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, USB On-The-Go USB Type-C 2.0, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
3.5mm Jack No
24-bit/192kHz audio
No

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