Redmi Pad SE 对比 Honor Pad 9

Price: RM659   799 RM1479   1799
发布
Release Status Release 2023, Sep 27 Release 2024, Apr 22
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 610 Adreno 710
Memory 8GB RAM, 256GB ROM 256GB, 16GB RAM
Card Slot microSDXC microSDXC (cellular model only)
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 8300 mAh, non-removable battery
35W wired
OS Android 13, MIUI Pad 14 Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 278.2 x 180.1 x 6.9 mm
Body Weight 478g 568g
Body Type Glass front, aluminum back, aluminum frame Glass front, aluminum frame, aluminum back
Stylus support
Colors Lavender Purple, Graphite Gray, Mint Green Space Gray, Cyan Lake
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 13 MP, f/2.0, (wide), AF
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No Yes
Data Speed LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
3.5mm Jack Yes
24-bit/192kHz audio
No

热门对比·:

«
»