Redmi Pad 对比 Honor Pad X9

Redmi Pad
Honor Pad X9
Price: 从 RM679   1099 从 RM679   1099
发布
Release Status Release 2022, Oct 05 Release 2023, Jul 20
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset MediaTek Helio G99 (6nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G57 MC2 Adreno 610
Memory 6GB RAM, 128GB ROM 128GB, 4GB RAM
Card Slot microSDXC No
Battery Li-Po 8000 mAh, non-removable battery
Fast charging 18W		 Li-Po 7250 mAh, non-removable battery
OS Android 12, MIUI 13 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 400 nits (typ) TFT LCD, 120Hz
Display Size 10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)		 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 250.5 x 158.1 x 7.1 mm 267.3 x 167.4 x 6.9 mm
Body Weight 465g 495g
Body Type Metal frame Glass front, aluminum frame, aluminum back
Colors Graphite Gray, Moonlight Silver, Mint Green Space Gray
摄像头
Rear Camera 8 MP, AF 5 MP, f/2.2, AF
Front Camera 8 MP, 105° 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.3, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C USB Type-C, OTG
传感器
Sensor Yes Accelerometer
GPS Unspecified
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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