Honor Pad X9 对比 Redmi Pad SE

Honor Pad X9
Redmi Pad SE
Price: 从 RM989   1499 从 RM659   799
发布
Release Status Release 2023, Jul 20 Release 2023, Sep 27
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 610 Adreno 610
Memory 256GB, 8GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC
Battery Li-Po 7250 mAh, non-removable battery Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 13, MagicOS 7.1 Android 13, MIUI Pad 14
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 90Hz, 400 nits (typ)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)		 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 255.5 x 167.1 x 7.4 mm
Body Weight 495g 478g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum back, aluminum frame
Colors Space Gray Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 5 MP, f/2.2, AF 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 5 MP, f/2.2 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

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