Samsung Galaxy Tab A9 对比 Honor Pad 9

Price: RM618   899 RM1249   1499
发布
Release Status Release 2023, Oct 23 Release 2024, Mar 20
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Mediatek Helio G99 (6nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Mali-G57 MC2 Adreno 710
Memory 4GB RAM, 64GB ROM 256GB, 8GB RAM
Card Slot microSDXC (dedicated slot) No
Battery Li-Po 5100 mAh, non-removable battery
15W wired
8300 mAh, non-removable battery
35W wired
OS Android 13, One UI 5.1 Android 13, Magic OS 7.2
显示屏
Display Type TFT LCD IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 8.7 inches, 214.9 cm2 (~81.7% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 211 x 124.7 x 8 mm 278.2 x 180.1 x 7 mm
Body Weight 333g 559g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Colors Mystic Navy, Graphite, Mystic Silver Space Gray, Cyan Lake
摄像头
Rear Camera 8 MP, AF 13 MP, f/2.0, (wide), AF
Front Camera 2 MP 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: Yes
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card Nano-SIM, eSIM No
Data Speed HSPA, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0 USB Type-C 2.0, OTG
传感器
Sensor Accelerometer, proximity, compass Accelerometer
GPS GPS, GLONASS, BDS, GALILEO, QZSS No
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (8 speakers)
3.5mm Jack Yes No

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