Redmi Pad SE 对比 Honor Pad X8

Price: RM659   799 RM449   899
发布
Release Status Release 2023, Sep 27 Release 2022, Nov 03
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) MediaTek MT8786
GPU Adreno 610 Mali-G52
Memory 8GB RAM, 256GB ROM 64GB, 4GB RAM
Card Slot microSDXC microSDXC (dedicated)
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 5100 mAh, non-removable battery
OS Android 13, MIUI Pad 14 Android 10, Magic UI 4
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) TFT LCD
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~224 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 240.2 x 159 x 7.6 mm
Body Weight 478g 460g
Body Type Glass front, aluminum back, aluminum frame
Colors Lavender Purple, Graphite Gray, Mint Green Dark Blue, Light Blue
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 5 MP
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 2 MP
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie:
连接与通讯
Sim Card No Yes
Data Speed 4G LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, USB On-The-Go
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No Yes, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers
3.5mm Jack Yes
24-bit/192kHz audio
No

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