Xiaomi Pad 6 对比 Honor Pad X8

Price: RM892   1299 RM449   899
发布
Release Status Release 2023, Jul 18 Release 2022, Nov 03
性能与续航
CPU Octa-core (1x3.2 GHz Kryo 585 & 3x2.42 GHz Kryo 585 & 4x1.80 GHz Kryo 585) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM8250-AC Snapdragon 870 5G (7 nm) MediaTek MT8786
GPU Adreno 650 Mali-G52
Memory 128GB 6GB RAM, UFS 3.1 64GB, 4GB RAM
Card Slot No microSDXC (dedicated)
Battery Li-Po 8840 mAh, non-removable battery
33W wired, PD3.0, QC4
Li-Po 5100 mAh, non-removable battery
OS Android 13, MIUI 14 Android 10, Magic UI 4
显示屏
Display Type IPS LCD, 1B colors, 144Hz, HDR10, Dolby Vision, 550 nits TFT LCD
Display Size 11.0 inches, 350.9 cm2 (~83.6% screen-to-body ratio)
1800 x 2880 pixels, 16:10 ratio (~309 ppi density)
10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~224 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 254 x 165.2 x 6.5 mm 240.2 x 159 x 7.6 mm
Body Weight 490g 460g
Body Type Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Colors Gravity Gray, Gold, Mist blue Dark Blue, Light Blue
摄像头
Rear Camera 13 MP, f/2.2, PDAF 5 MP
Front Camera 8 MP, f/2.2, 1/4", 1.12µm 2 MP
Video 4K@30fps, 1080p@30/60fps
Selfie: 1080p@30fps
1080p@30fps
Selfie:
Camera Features Dual-LED flash, HDR, panorama
连接与通讯
Sim Card No Yes
Data Speed 4G LTE
WLAN Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 3.2, accessory connector USB Type-C, USB On-The-Go
传感器
Sensor Accelerometer, gyro, proximity (accessories only) Accelerometer
GPS Yes, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz audio
No

热门对比·:

«
»