Honor MagicPad 13 对比 Honor Pad X8 Pro

Price: RM2309  
发布
Release Status Coming soon. Exp. release 2023, July Available. Released 2023, July 05
性能与续航
CPU Octa-core (1x2.84 GHz Cortex-X1 & 3x2.42 GHz Cortex-A78 & 4x1.80 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM8350 Snapdragon 888 5G (5 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 660 Adreno 610
Memory 256GB 8GB RAM, 256GB 12GB RAM, 512GB 16GB RAM 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM
Card Slot No No
Battery Li-Po 10050 mAh, non-removable battery
66W wired
5W reverse wired
Li-Po 7250 mAh, non-removable battery
OS Android 13, MagicOS 7.2 Android 13, MagicOS 7.1
显示屏
Display Type TFT LCD, 1B colors, 144Hz, IMAX Enhanced, HDR10, 700 nits (HBM) TFT LCD, 120Hz
Display Size 13.0 inches, 494.7 cm2 (~88.7% screen-to-body ratio)
1840 x 2880 pixels (~263 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 291.7 x 191.1 x 6.5 mm 267.3 x 167.4 x 6.9 mm
Body Weight 673g 495g
Body Type Stylus support (2ms) Glass front, aluminum frame, aluminum back
Colors Gray, Blue, Gold Gray, Purple, Mint
摄像头
Rear Camera 13 MP, f/2.0, AF 5 MP, f/2.2, AF
Front Camera 9 MP, f/2.2 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash, HDR HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 3.2, OTG, DisplayPort, magnetic connector USB Type-C, OTG
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

热门对比·:

«
»