Honor Pad 9 对比 realme Pad

Price: RM1249   1499 RM779   1199
发布
Release Status Release 2024, Mar 20 Release 2021, Nov 03
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Mediatek MT6769V/CU Helio G80 (12 nm)
GPU Adreno 710 Mali-G52 MC2
Memory 256GB, 8GB RAM 6GB + 128GB
Card Slot No microSDXC (uses shared SIM slot)
Battery 8300 mAh, non-removable battery
35W wired
Li-Po 7100 mAh, non-removable battery
Fast charging 18W
Reverse charging
OS Android 13, Magic OS 7.2 Android 11
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 360 nits (typ)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
10.4 inches, 307.9 cm2 (~80.2% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~224 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm 246.1 x 155.9 x 6.9 mm
Body Weight 559g 440g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Colors Space Gray, Cyan Lake Gray, Gold
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 8 MP
Front Camera 8 MP, f/2.2, (wide) 8 MP, 105˚ (ultrawide)
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer Accelerometer, gyro, proximity
GPS No Yes, with A-GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
-22.4 LUFS (Excellent)
3.5mm Jack No Yes
24-bit/192kHz audio

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