Honor Pad X8 Lite 对比 Redmi Pad SE

Price: RM729   799
发布
Release Status Coming soon. Exp. release 2022, September Release 2023, Sep 27
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Mediatek MT8786 Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 610
Memory 32GB 8GB RAM, 256GB ROM
Card Slot Unspecified microSDXC
Battery Li-Po 5100 mAh, non-removable battery Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 12, Magic UI 6.1 Android 13, MIUI Pad 14
显示屏
Display Type IPS LCD IPS LCD, 90Hz, 400 nits (typ)
Display Size 9.7 inches, 272.8 cm2 (~71.4% screen-to-body ratio)
800 x 1280 pixels, 16:10 ratio (~156 ppi density)
11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 240.2 x 159 x 7.6 mm 255.5 x 167.1 x 7.4 mm
Body Weight 460g 478g
Body Type Glass front, aluminum back, aluminum frame
Colors Mint Blue Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 5 MP 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 2 MP 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie: 720p@30fps
1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card Nano-SIM No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS No No
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

热门对比·:

«
»