Redmi Pad 对比 Honor Pad 6

Price: RM620   999
发布
Release Status Release 2022, Oct 05 Coming soon. Exp. release 2020, September
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.0 GHz Cortex-A73 & 4x1.7 GHz Cortex-A53)
Chipset MediaTek Helio G99 (6nm) Kirin 710A (14 nm)
GPU Mali-G57 MC2 Mali-G51 MP4
Memory 4GB RAM, 128GB ROM 32GB 3GB RAM, 64GB 4GB RAM
Card Slot microSDXC Unspecified
Battery Li-Po 8000 mAh, non-removable battery
Fast charging 18W
Li-Po 5100 mAh, non-removable battery
Charging 10W
OS Android 12, MIUI 13 Android 10, Magic UI 3.1, no Google Play Services
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 400 nits (typ) IPS LCD capacitive touchscreen, 16M colors
Display Size 10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)
10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~224 ppi density)
机身
Body Dimension 250.5 x 158.1 x 7.1 mm 240.2 x 159 x 7.6 mm
Body Weight 465g 460g
Body Type Metal frame Glass front, aluminum frame, aluminum back
Stylus support
Colors Graphite Gray, Moonlight Silver, Mint Green Space Gray
摄像头
Rear Camera 8 MP, AF 5 MP, f/2.2, AF
Front Camera 8 MP, 105° 2 MP, f/2.4
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie:
Camera Features HDR, panorama
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.3, A2DP, LE 5.1, A2DP, LE
NFC No
USB USB Type-C 2.0, Type-C 1.0 reversible connector
传感器
Sensor Yes Accelerometer
GPS Unspecified Yes
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers
3.5mm Jack No Yes

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