Redmi Pad Pro 对比 Honor Pad X9

Price: RM1499   RM909   1499
发布
Release Status Release 2024, Jun 28 Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.40 GHz Cortex-A78 & 4x1.95 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM7435-AB Snapdragon 7s Gen 2 (4 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 710 Adreno 610
Memory 8GB RAM, 256GB ROM 256GB, 8GB RAM
Card Slot microSDXC (dedicated slot) No
Battery 10000 mAh, non-removable battery
33W wired, PD3.0, QC3+
Li-Po 7250 mAh, non-removable battery
OS Android 14, HyperOS Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 68B colors, 120Hz, Dolby Vision, 600 nits (HBM) TFT LCD, 120Hz
Display Size 12.1 inches, 424.5 cm2 (~83.4% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 280 x 181.9 x 7.5 mm 267.3 x 167.4 x 6.9 mm
Body Weight 571g 495g
Body Type Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Glass front, aluminum frame, aluminum back
Colors Graphite Gray, Mint Green, Ocean Blue Space Gray
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4.0", 1.12µm 5 MP, f/2.2, AF
Front Camera 8 MP, f/2.3, (wide), 1/4.0", 1.12µm 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash HDR
连接与通讯
Sim Card No No
Data Speed NA
WLAN Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE, aptX HD, aptX Adaptive 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0 USB Type-C, OTG
传感器
Sensor Accelerometer, gyro, proximity (accessories only), compass Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack Yes
24-bit/192kHz Hi-Res audio
No

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