Redmi Pad SE 对比 realme Pad

Price: RM729   799 RM549   1199
发布
Release Status Release 2023, Sep 27 Release 2021, Nov 03
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Mediatek MT6769V/CU Helio G80 (12 nm)
GPU Adreno 610 Mali-G52 MC2
Memory 8GB RAM, 256GB ROM 6GB + 128GB
Card Slot microSDXC microSDXC (uses shared SIM slot)
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 7100 mAh, non-removable battery
Fast charging 18W
Reverse charging
OS Android 13, MIUI Pad 14 Android 11
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 360 nits (typ)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
10.4 inches, 307.9 cm2 (~80.2% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~224 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 246.1 x 155.9 x 6.9 mm
Body Weight 478g 440g
Body Type Glass front, aluminum back, aluminum frame Glass front, aluminum frame, aluminum back
Colors Lavender Purple, Graphite Gray, Mint Green Gray, Gold
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 8 MP
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 8 MP, 105˚ (ultrawide)
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.0, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer, gyro, proximity
GPS No Yes, with A-GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
-22.4 LUFS (Excellent)
3.5mm Jack Yes
24-bit/192kHz audio
Yes
24-bit/192kHz audio

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