Honor Pad X9 对比 realme Pad X

Price: RM679   1099 RM709   1699
发布
Release Status Release 2023, Jul 20 Release 2022, May 26
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6375 Snapdragon 695 5G (6 nm)
GPU Adreno 610 Adreno 619
Memory 128GB, 4GB RAM 6GB RAM, 128GB ROM
Card Slot No microSDXC
Battery Li-Po 7250 mAh, non-removable battery Li-Po 8340 mAh, non-removable battery
Fast charging 33W
Reverse charging
USB Power Delivery
OS Android 13, MagicOS 7.1 Android, Realme UI 3.0
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 450 nits (peak)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm
Body Weight 495g 499g
Body Type Glass front, aluminum frame, aluminum back Glass front, plastic frame, plastic back
Stylus support (magnetic charging)
Colors Space Gray Glowing Gray, Glacier Blue
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.2, (wide)
Front Camera 5 MP, f/2.2 8 MP, f/2.0, 105˚ (ultrawide)
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR Panorama
连接与通讯
Sim Card No Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 b/g/n/ac, hotspot
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No
24-bit/192kHz audio

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