Realme Pad 2 对比 Honor Pad X9

Price: RM899   1299 RM989   1499
发布
Release Status Release 2023, Sep 01 Release 2023, Jul 20
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Mediatek MT8781 Helio G99 (6nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G57 MC2 Adreno 610
Memory 6GB RAM, 128GB ROM 256GB, 8GB RAM
Card Slot microSDXC (uses shared SIM slot) No
Battery Li-Po 8360 mAh, non-removable battery
33W wired
Li-Po 7250 mAh, non-removable battery
OS Android 13, Realme UI 4 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 450 nits (peak) TFT LCD, 120Hz
Display Size 11.5 inches, 376.4 cm2
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm
Body Weight 495g
Body Type Glass front, aluminum frame, aluminum back
Colors Gray, Green Space Gray
摄像头
Rear Camera 8 MP 5 MP, f/2.2, AF
Front Camera 8 MP 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Nano-SIM No
Data Speed HSPA, LTE
WLAN Yes Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth Yes 5.1, A2DP, LE
NFC No No
USB USB Type-C USB Type-C, OTG
传感器
Sensor Fingerprint (side-mounted), unspecified sensors Accelerometer
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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