Redmi Pad SE 对比 Huawei MediaPad T5

Price: RM659   799 RM850   999
发布
Release Status Release 2023, Sep 27 Release 2019, Jan 23
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.36 GHz Cortex-A53 & 4x1.7 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) HiSilicon Kirin 659 (16 nm)
GPU Adreno 610 Mali-T830 MP2
Memory 8GB RAM, 256GB ROM 3GB RAM, 32GB ROM
Card Slot microSDXC microSD, up to 256 GB
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Non-removable Li-Po 5100 mAh battery
OS Android 13, MIUI Pad 14 Android 8.0 (Oreo); EMUI 8
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD capacitive touchscreen, 16M colors
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
10.1 inches, 295.8 cm2 (~74.2% screen-to-body ratio)
1920 x 1200 pixels, 16:10 ratio (~224 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 243 x 164 x 7.8 mm
Body Weight 478g 460g
Body Type Glass front, aluminum back, aluminum frame Front glass, aluminum body
Colors Lavender Purple, Graphite Gray, Mint Green Black, Champagne Gold
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 5 MP, f/2.4, AF
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 2 MP, f/2.4
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
连接与通讯
Sim Card No No. Wifi Version
Data Speed -
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, WiFi Direct, hotspot
Bluetooth 5.0, A2DP, LE 4.2, A2DP, LE
NFC No
USB USB Type-C, OTG microUSB 2.0
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No Yes, with A-GPS (LTE model), GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers
3.5mm Jack Yes
24-bit/192kHz audio
Yes

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