Redmi Pad SE 对比 Redmi Pad

Redmi Pad SE
Redmi Pad
Price: 从 RM659   799 从 RM599   1099
发布
Release Status Release 2023, Sep 27 Release 2022, Oct 05
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) MediaTek Helio G99 (6nm)
GPU Adreno 610 Mali-G57 MC2
Memory 8GB RAM, 256GB ROM 6GB RAM, 128GB ROM
Card Slot microSDXC microSDXC
Battery Li-Po 8000 mAh, non-removable battery
10W wired		 Li-Po 8000 mAh, non-removable battery
Fast charging 18W
OS Android 13, MIUI Pad 14 Android 12, MIUI 13
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 1B colors, 90Hz, 400 nits (typ)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)		 10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 250.5 x 158.1 x 7.1 mm
Body Weight 478g 465g
Body Type Glass front, aluminum back, aluminum frame Metal frame
Colors Lavender Purple, Graphite Gray, Mint Green Graphite Gray, Moonlight Silver, Mint Green
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 8 MP, AF
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 8 MP, 105°
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.0, A2DP, LE 5.3, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C
传感器
Sensor Accelerometer, proximity (accessories only) Yes
GPS No Unspecified
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack Yes
24-bit/192kHz audio		 No

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