Xiaomi Pad 6 对比 Honor Pad X9

Price: RM892   1299 RM679   1099
发布
Release Status Release 2023, Jul 18 Release 2023, Jul 20
性能与续航
CPU Octa-core (1x3.2 GHz Kryo 585 & 3x2.42 GHz Kryo 585 & 4x1.80 GHz Kryo 585) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM8250-AC Snapdragon 870 5G (7 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 650 Adreno 610
Memory 128GB 6GB RAM, UFS 3.1 128GB, 4GB RAM
Card Slot No No
Battery Li-Po 8840 mAh, non-removable battery
33W wired, PD3.0, QC4
Li-Po 7250 mAh, non-removable battery
OS Android 13, MIUI 14 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 144Hz, HDR10, Dolby Vision, 550 nits TFT LCD, 120Hz
Display Size 11.0 inches, 350.9 cm2 (~83.6% screen-to-body ratio)
1800 x 2880 pixels, 16:10 ratio (~309 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 254 x 165.2 x 6.5 mm 267.3 x 167.4 x 6.9 mm
Body Weight 490g 495g
Body Type Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Glass front, aluminum frame, aluminum back
Colors Gravity Gray, Gold, Mist blue Space Gray
摄像头
Rear Camera 13 MP, f/2.2, PDAF 5 MP, f/2.2, AF
Front Camera 8 MP, f/2.2, 1/4", 1.12µm 5 MP, f/2.2
Video 4K@30fps, 1080p@30/60fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features Dual-LED flash, HDR, panorama HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 3.2, accessory connector USB Type-C, OTG
传感器
Sensor Accelerometer, gyro, proximity (accessories only) Accelerometer
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No
24-bit/192kHz audio
No

热门对比·:

«
»