Honor Pad X9 对比 Honor Pad 9

Honor Pad X9
Honor Pad 9
Price: 从 RM679   1099 从 RM1479   1799
发布
Release Status Release 2023, Jul 20 Release 2024, Apr 22
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 610 Adreno 710
Memory 128GB, 4GB RAM 256GB, 16GB RAM
Card Slot No microSDXC (cellular model only)
Battery Li-Po 7250 mAh, non-removable battery Li-Po 8300 mAh, non-removable battery
35W wired
OS Android 13, MagicOS 7.1 Android 13, Magic OS 7.2
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)		 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 278.2 x 180.1 x 6.9 mm
Body Weight 495g 568g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray Space Gray, Cyan Lake
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.0, (wide), AF
Front Camera 5 MP, f/2.2 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps		 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR HDR
连接与通讯
Sim Card No Yes
Data Speed LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
3.5mm Jack No No

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