Redmi Pad SE 对比 Oppo Pad Air

Price: RM659   799 RM454   1099
发布
Release Status Release 2023, Sep 27 Release 2022, Jul 21
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 610 Adreno 610
Memory 8GB RAM, 256GB ROM 4GB RAM, 64GB ROM
Card Slot microSDXC +3GB Extended RAM
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 7100 mAh, non-removable battery
18W wired, PD
5W reverse wired
OS Android 13, MIUI Pad 14 Android 12, ColorOS 12
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 1B colors, 360 nits (typ)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
10.36 inches, 305.5 cm2 (~80.5% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~225 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 245.1 x 154.8 x 6.9 mm
Body Weight 478g 440g
Body Type Glass front, aluminum back, aluminum frame Stylus support
Colors Lavender Purple, Graphite Gray, Mint Green Grey
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 8 MP, f/2.0, AF
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features Panorama
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE, aptX HD
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer, gyro, compass
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
-28.3 LUFS (Average)
3.5mm Jack Yes
24-bit/192kHz audio
No

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