Honor Pad X9 对比 Honor Pad X8 Pro

Price: RM679   1099 RM1029  
发布
Release Status Release 2023, Jul 20 Available. Released 2023, July 05
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610 Adreno 610
Memory 128GB, 4GB RAM 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM
Card Slot No No
Battery Li-Po 7250 mAh, non-removable battery Li-Po 7250 mAh, non-removable battery
OS Android 13, MagicOS 7.1 Android 13, MagicOS 7.1
显示屏
Display Type TFT LCD, 120Hz TFT LCD, 120Hz
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 267.3 x 167.4 x 6.9 mm
Body Weight 495g 495g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Colors Space Gray Gray, Purple, Mint
摄像头
Rear Camera 5 MP, f/2.2, AF 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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